Photonic Integrated Circuits (PICs) are devices that integrate multiple optical components, such as lasers, modulators, photodetectors, and waveguides, on a single chip. They are the optical analog of electronic integrated circuits and can perform various functions in optical communications, sensing, and computing.

Here are some of the applications of Photonic Integrated Circuits:

1. Optical Communication: PICs are used in optical communication systems, such as fiber-optic networks and data centers. They enable the efficient manipulation and routing of optical signals, leading to faster data transfer rates and lower power consumption.
2. Sensing: PICs are also used in various sensing applications, such as biochemical sensing, environmental monitoring, and security systems. They can detect changes in optical signals caused by changes in temperature, pressure, or chemical composition, and convert them into electrical signals for analysis.
3.  Quantum Computing: PICs are a promising platform for quantum computing because they can generate and manipulate single photons with high precision. They can also be used to implement quantum gates, which are essential building blocks for quantum circuits.
4. Biomedical Imaging: PICs can be used in biomedical imaging applications, such as optical coherence tomography (OCT) and fluorescence microscopy. They enable the generation and manipulation of light signals for high-resolution imaging of biological tissues and cells.
5.  Lidar: PICs can be used in Lidar (Light Detection and Ranging) systems, which are used for remote sensing and mapping applications. They can generate and detect light signals with high precision, allowing for accurate measurements of distances and positions.
   
   

   Overall, PICs offer significant advantages over traditional optical components, including reduced size, weight, and cost, increased functionality, and improved performance.
   
   

   Opticlarity supports companies with the fiber optic interconnect solutions and provides access to eco systems active in the design, manufacture and packaging of PIC’s working with Indium Phosphide and Silicon Nitride.